Otimização no Processamento de Wafers na Manufatura de Semicondutores
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Data
2023-07-22
Tipo de documento
Monografia
Título da Revista
ISSN da Revista
Título de Volume
Área do conhecimento
Engenharias
Modalidade de acesso
Acesso aberto
Editora
Autores
Cunha, Roger Brendel da
Orientador
Silva, Adriano Menezes da
Coorientador
Resumo
Os processos produtivos sejam eles qual forem, exigem sempre o maior e melhor aproveitamento de seus recursos. A busca pela melhoria e eficiência é sempre um grande desafio para as empresas em todo o mundo. Com base neste conceito, será analisada uma maneira de obter um melhor aproveitamento e maior produtividade na manufatura de semicondutores, mais especificamente no processamento de wafers de Silício, que, na sua estrutura possuem milhares de componentes que compõem um chip de memória. O fluxograma produtivo deste insumo possui diversas etapas devido a sua criticidade e fragilidade e o principal objetivo será eliminar um destes processos. Através deste estudo, será possível comprovar que pode ser eliminado uma etapa deste fluxograma utilizando um equipamento de pulsação a laser chamado Stealth Dicing. Durante os experimentos, serão analisadas as características da propagação das trincas geradas pela emissão do laser no Silício e também as características técnicas entre equipamentos Stealth Dicing utilizando diferentes parâmetros de processo, como potência do laser, velocidade de avanço e quantidade de passes. Aplicando a otimização de projeto proposta, é possível aumentar a eficiência do processo em até 60% dependendo dos parâmetros escolhidos. Além da Stealth Dicing, o equipamento Backside Grinding foi analisado tendo em vista o que ambos trabalham em conjunto no processamento do wafer. Em 2022 ambos os equipamentos tiveram 97% de disponibilidade produtiva, o que permite viabilizar o estudo proposto.
The production processes, whatever they may be, always demand the greatest and best use of its resources. The search for improvement and efficiency is always a great challenge for companies around the world. Based on this concept, a way to obtain better use and greater productivity in the manufacture of semiconductors will be analyzed, more specifically in the processing of Silicon wafers, which, in their structure have thousands of components that make up a memory chip. The production flowchart of this input has several stages due to its criticality and fragility and the main objective will be to eliminate one of these processes. Through this study, it will be possible to prove that a step of this flowchart can be eliminated using a laser pulsation equipment called Stealth Dicing. During the experiments, the propagation characteristics of the cracks generated by the emission of the laser in Silicon will be analyzed, as well as the characteristics between Stealth Dicing equipment using different process parameters, such as laser power, advance speed and number of passes. Using the proposed design change, it is possible to increase the process efficiency by up to 60% depending on the chosen parameters. In addition to Stealth Dicing, the Backside Grinding equipment was analyzed considering that both work together in wafer processing. In 2022 both equipment’s had 97% production availability, which allows the proposed study to be feasible.
The production processes, whatever they may be, always demand the greatest and best use of its resources. The search for improvement and efficiency is always a great challenge for companies around the world. Based on this concept, a way to obtain better use and greater productivity in the manufacture of semiconductors will be analyzed, more specifically in the processing of Silicon wafers, which, in their structure have thousands of components that make up a memory chip. The production flowchart of this input has several stages due to its criticality and fragility and the main objective will be to eliminate one of these processes. Through this study, it will be possible to prove that a step of this flowchart can be eliminated using a laser pulsation equipment called Stealth Dicing. During the experiments, the propagation characteristics of the cracks generated by the emission of the laser in Silicon will be analyzed, as well as the characteristics between Stealth Dicing equipment using different process parameters, such as laser power, advance speed and number of passes. Using the proposed design change, it is possible to increase the process efficiency by up to 60% depending on the chosen parameters. In addition to Stealth Dicing, the Backside Grinding equipment was analyzed considering that both work together in wafer processing. In 2022 both equipment’s had 97% production availability, which allows the proposed study to be feasible.
Palavras-chave
Semicondutores, Produtividade